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 STC5NF20V
N-channel 20V - 0.030 - 5A - TSSOP8 2.7V-drive STripFETTM II Power MOSFET
Features
Type STC5NF20V

VDSS 20V
RDS(on) < 0.040 (@ 4.5 V) < 0.045 (@ 2.7 V)
ID 5A
Ultra low threshold gate drive (2.7V) Standard outline for easy automated surface mount assembly
TSSOP8
Application
Switching applications Figure 1. Internal schematic diagram
Description
This Power MOSFET is the latest development of STMicroelectronics unique "single feature size" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
Table 1.
Device summary
Marking 5N20V Package TSSOP8 Packaging Tape & reel
Order code STC5NF20V
October 2007
Rev 6
1/12
www.st.com 12
Contents
STC5NF20V
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuit
................................................ 8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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STC5NF20V
Electrical ratings
1
Electrical ratings
Table 2.
Symbol VDS VDGR VGS ID ID IDM
(1)
Absolute maximum ratings
Parameter Drain-source voltage (VGS = 0) Drain-gate voltage (RGS = 20K) Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (pulsed) Total dissipation at TC = 25C Storage temperature Max. Operating junction temperature Value 20 20 12 5 3 20 1.5 -55 to 150 -55 to 150 Unit V V V A A A W C C
PTOT Tstg TJ
1. Pulse width limited by safe operating area
Table 3.
Symbol
Thermal data
Parameter Value 100 (1) 83.5
(2)
Unit C/W C/W
RthJ-PBC Thermal resistance junction-PBC Max RthJ-PBC Thermal resistance junction-PBC Max
2. When Mounted on minimum recommended footprint
1. When Mounted on FR-4 board with 1 inch2 pad, 2 oz. of Cu. and t = 10 sec.
3/12
Electrical characteristics
STC5NF20V
2
Electrical characteristics
(TCASE=25C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On/off states
Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250A, VGS= 0 VDS = Max rating, VDS = Max rating @125C VGS = 12V VDS= VGS, ID = 250A VGS= 4.5V, ID= 2.5A VGS =2.7V, ID = 2.5A 0.6 0.030 0.037 0.040 0.045 Min. 20 1 10 100 Typ. Max. Unit V A A nA V
Table 5.
Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 15 V, ID = 2.5A VDS =15V, f = 1 MHz, VGS = 0 Min. Typ. 9.5 460 200 50 8.5 1.8 2.4 11.5 Max. Unit S pF pF pF nC nC nC
VDD =10V, ID = 4.5A VGS =4.5V
1. Pulsed: pulse duration=300s, duty cycle 1.5%
Table 6.
Symbol td(on) tr td(off) tf td(off) tf tc
Switching times
Parameter Turn-on delay time Rise time Turn-off delay time Fall time Off-voltage rise time Fall time Cross-over time Test conditions VDD= 10V, ID= 2.5A, RG=4.7, VGS=4.5V Figure 14 on page 8 Vclamp =16V, ID = 5A RG = 4.7, VGS = 4.5V Figure 16 on page 8 Min. Typ. 7 33 27 10 26 11 21 Max. Unit ns ns ns ns ns ns ns
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STC5NF20V
Electrical characteristics
Table 7.
Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 5A, VGS = 0 ISD = 5A, di/dt = 100A/s, VDD = 10V, TJ = 150C Figure 16 on page 8 26 13 1 Test conditions Min. Typ. Max 5 20 1.2 Unit A A V ns C A
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5%
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Electrical characteristics
STC5NF20V
2.1
Figure 2.
Electrical characteristics (curves)
Safe operating area Figure 3. Thermal impedance
Figure 4.
Output characteristics
Figure 5.
Transfer characteristics
Figure 6.
Transconductance
Figure 7.
Static drain-source on resistance
6/12
STC5NF20V Figure 8. Gate charge vs. gate-source voltage Figure 9.
Electrical characteristics Capacitance variations
Figure 10. Normalized gate threshold voltage vs. temperature
Figure 11. Normalized on resistance vs. temperature
Figure 12. Source-drain diode forward characteristics
Figure 13. Thermal resistance and max power
7/12
Test circuit
STC5NF20V
3
Test circuit
Figure 15. Gate charge test circuit
Figure 14. Switching times test circuit for resistive load
Figure 16. Test circuit for inductive load Figure 17. Unclamped Inductive load test switching and diode recovery times circuit
Figure 18. Unclamped inductive waveform
8/12
STC5NF20V
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package mechanical data
STC5NF20V
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STC5NF20V
Revision history
5
Revision history
Table 8.
Date 09-Sep-2004 03-Aug-2006 01-Feb-2007 25-Oct-2007
Document revision history
Revision 3 4 5 6 Initial electronic version The document has been reformatted, SOA updated Typo mistake on Table 2. Update marking on Table 1 Changes
11/12
STC5NF20V
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